Diodes ZXTC2045E6 Manual de usuario descargar pdf (Pagina 2)

ZXTC2045E6

Document Number: DS33645 Rev: 2 - 2

2 of 6

www.diodes.com

November 2012

ZXTC2045E6

ADVANCE INFORMATION

Product Line o

Diodes Incorporated

Maximum Ratings – Q1 (NPN Transistor) (@T

= +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit

Collector-Base Voltage

CBO

40 V

Collector-Emitter Voltage

CEV

40 V

Collector-Emitter Voltage

CEO

30 V

Emitter-Base Voltage

EBO

7 V

Continuous Collector Current

1.5 A

Peak Pulsed Collector Current

5 A

Base Current

1 A

Maximum Ratings – Q2 (PNP Transistor) (@T

= +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit

Collector-Base Voltage

CBO

-40 V

Collector-Emitter Voltage

CEV

-40 V

Collector-Emitter Voltage

CEO

-30 V

Emitter-Base Voltage

EBO

-7 V

Continuous Collector Current

-1.5 A

Peak Pulsed Collector Current

-5 A

Base Current

-1 A

Thermal Characteristics (@T

= +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit

Power Dissipation

Linear Derating Factor

(Notes 6 & 10)

0.7

5.6

mW/°C

(Notes 7 & 10)

0.9

7.2

(Notes 7 & 11)

1.1

8.8

(Notes 8 & 10)

1.1

8.8

(Notes 9 & 10)

1.7

13.6

Thermal Resistance, Junction to Ambient

(Notes 6 & 10)

179

°C/W

(Notes 7 & 10) 139

(Notes 7 & 11) 113

(Notes 8 & 10) 113

(Notes 9 & 10) 73

Thermal Resistance, Junction to Lead (Note 12)

95.50

Operating and Storage Temperature Range

, T

STG

-55 to +150

°C

Notes: 6. For a device surface mounted on 15mm x 15mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured

when operating in a steady-state condition.

7. Same as note (6), except the device is surface mounted on 25mm x 25mm 1oz copper.

8. Same as note (6), except the device is surface mounted on 50mm x 50mm 2oz copper.

9. Same as note (8), except the device is measured at t < 5 seconds.

10. For device with one active die, both collectors attached to a common heatsink.

11. For device with two active dice running at equal power, split heatsink 50% to each collector.

12. Thermal resistance from junction to solder-point (at the end of the collector lead).

1 2 3 4 5 6

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